The core of mobile phone/tablet design is to meet the requirements of portability, which requires lightweight, thin, long-lasting power, and high working efficiency. Traditional heat dissipation design mainly transfers the heat generated by high heating components such as CPU, GPU, Chipset, HDD through the packaging surface to the heat dissipation solder paste, and then guides it to the heat sink or metal block with high thermal conductivity characteristics, and then conducts it to the heat dissipation device (such as fan, heat sink, etc.) through the heat pipe (Heat Pip) to dissipate the heat to the exhaust hole. The cost of commonly used heat dissipation fins with good thermal conductivity is too high, and the thermal conductivity of aluminum alloy heat transfer fins cannot keep up with the heating rate of the system operation.
To meet the cooling needs of tablet computers, high-quality specifications of cooling materials have emerged.
Dongguan M-Victory Material Technology Co., Ltd. provides high-performance thermal interface materials and complete solutions. Provide specialized customized product development services for end customers, meeting the characteristics of rapid market research and development cycles and the requirements of continuous innovation.
