A server refers to software and hardware that can provide specific services to network users. Due to the needs of production learning and the popularity of mobile office, the growing number of cloud workers have increasingly high requirements for server storage and operation speed, which has become the main driving force for the rapid development of servers.
Under the demand for high-speed upload and download in areas such as Al, IoT, and 5G, server chip manufacturers are constantly innovating to improve the efficient thermal management of servers in order to achieve the fast response, non-stop operation, and scalability required by cloud operators.
In the architecture of various server products, the air-cooled and water-cooled designs of open loop systems are designed for high heat dissipation efficiency and high-density heat, with thermal interface materials playing an essential role.
Dongguan M-Victory Material Technology Co., Ltd.'s high thermal conductivity and low thermal resistance thermal interface material can significantly enhance the efficiency of high-power chips. Through the design of air-cooled and water-cooled heat dissipation modules, it can effectively achieve the high-speed storage and energy-saving operation performance required by servers.
