With the continuous intellectualization of electronic products, as the hub of the Internet, Netcom products are developing in the direction of high-speed, high-quality and easy integrated management, which puts forward higher requirements for the quality of Netcom products. However, the increase in working frequency, work intensity, and network speed has brought about the problem of increased power for network products, resulting in higher heat dissipation requirements.
As a bridge for 5G internet access, routers need to provide strong network transmission speed, which will inevitably generate huge heat. If the heat is too high during work, it will affect the wireless signal, such as unstable signal or network disconnection. In addition, in order to save costs and space, routers are developing towards miniaturization, which increases the difficulty of heat dissipation. In general, routers use passive heat dissipation, which means they dissipate heat through the body's heat dissipation holes. However, relying solely on the heat dissipation holes results in low heat dissipation efficiency. To address issues such as router heat dissipation and operational stability. Usually, the thermal conductive gel is used to fill the gap of the shielding cover on the front chip of the PCB, and can also be used for heat dissipation on the back of the chip. After curing, the thermal conductive gel is close to the thermal conductive gasket, with good reliability, low oil yield, good anti sag performance, no gas release, good toughness, good anti vibration performance, automatic production and other advantages.
